Tuesday, 19 November 2019 07:41

Research collaboration visit to TF-AMD Bayan Lepas

Written by Syarifah Nuraqmar
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Research collaboration visit by School of Materials Engineering to TF-AMD Bayan Lepas on 19 November 2019 for Thermal Interface Materials (TIM) research and development project in the field of electronic packaging materials.

 

 

Read 203 times Last modified on Wednesday, 11 December 2019 07:06

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